Manufacturing method of the electronic component

ABSTRACT

Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of application Ser. No.11/892,139 filed Aug. 20, 2007, now U.S. Pat. No. 8,093,616, and isbased upon and claims the benefit of priority from the prior JapanesePatent Application No. 2006-322460, filed on Nov. 29, 2006, the entirecontents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to electronic components,manufacturing methods of the electronic components, electronic componentassembly bodies, and electronic devices, and more specifically, to anelectronic component such as an LED (light emitting diode), amanufacturing method of the electronic component, an electroniccomponent assembly body having the electronic component, and anelectronic device having the electronic component assembly body.

2. Description of the Related Art

For example, as electronic components emitting light, light emittingcomponents such as a LED (Light Emitting Diode) diode or a laser diodehave become known. These electronic components are mounted on boards.Japanese Laid-Open Patent Application Publication No. 5-129711 describesa semiconductor laser device where a semiconductor laser chip ismounted. In this semiconductor laser device, laser light emanates fromthe semiconductor laser chip in a direction parallel (horizontal) with asurface direction of chip mount (board). In addition, the laser lightemanating in this horizontal direction is converted at 45 degrees by areflection mirror so as to irradiate in a direction perpendicular to thechip mount.

FIG. 1 is a perspective view of a first related art component mountingboard. More specifically, in the example shown FIG. 1, a componentmounting board 1A where an electronic component 3 is mounted on a board2 is shown. The electronic component 3 includes a semiconductor laserchip 9 and leads 5. The leads 5 extend to sides of the semiconductorlaser chip 9. Pads 4 are formed on a mounting position of the electroniccomponent 3 of the board 2. The electronic component 3 is mounted on theboard 2 by soldering the leads 5 to the pads 4. A light emitting surface8A of the electronic component 3 faces upward and therefore the laserlight is irradiated upward.

However, in the structure shown in FIG. 1 where the electronic component3 is surface mounted on the board 2, a projecting amount shown by anarrow “h” in FIG. 1 from a board surface 2 a of the board 2 of theelectronic component 3 is high, so that thickness of the entirecomponent mounting board 1A is large. While the projection height fromthe board surface 2 a of the electronic component 3 is approximatelyseveral mm through several tens mm, in a case where the electroniccomponent 3 is mounted on an electronic device such as a portable phonerequired to have small size and thickness, a dead space may be formedinside of the electronic device or interference with other componentsmay be generated.

Because of this, as discussed in Japanese Laid-Open Patent ApplicationPublication No. 8-186326, a structure where an opening is formed in aboard and an electronic component is inserted in the opening at the timeof mounting so that thickness of entire component mounting board can bemade small has been suggested. FIG. 2 is a perspective view of a secondrelated art component mounting board and shows such a mountingstructure.

As shown in FIG. 2. an opening part 6 is formed in a board 2. Pads areformed in the vicinity of the opening part 6. The electronic component 3is mounted on the board 2 in an inverted state where a light emittingsurface 8A faces downward and a rear surface 8B faces upward. Under thisstructure, since the electronic component 3 is positioned in the openingpart 6 and does not project from the surface of the board 2, it ispossible to make the entire component mounting board 1B have smallthickness.

However, in the mounting structure shown in FIG. 2 where the electroniccomponent 3 is simply made up side down and inserted in the opening part6, depending on the thickness of the board 2 where the electroniccomponent 3 is mounted, problem discussed below may be generated.

FIG. 3 is a perspective view for explaining the problems of the exampleshown in FIG. 2. More specifically, FIG. 3(A) shows a component mountingboard 1B having a thick board 2 where an electronic component 3 ismounted. FIG. 3(B) shows a component mounting board 1C having a thinboard 2 where the electronic component 3 is mounted. The thickness D1 ofthe board 2 shown in FIG. 3(A) is greater than the thickness D2 of theboard 2 shown in FIG. 3(B) (D1>D2).

In the case shown in FIG. 3(A) where the thickness D1 of the board 2 islarge, namely the opening part 6 is deep, the light emitting surface 8Aof the electronic component 3 is positioned at a deep point inside ofthe opening part 6 separated from the rear surface of the light emittingsurface 8A. Therefore, even if light L1 is irradiated from a deepposition of the opening part 6, the spread of the light L1 is blocked byan internal wall of the opening part 6 so as to be narrow.

On the other hand, in the case shown in FIG. 3(B) where the thickness D2of the board 2 is small, namely the opening part 6 is shallow, the lightemitting surface 8A of the electronic component 3 is positioned in thevicinity of the rear surface of the board 2. Therefore, in a case wherelight L2 is irradiated from a position in the vicinity of the rearsurface of the board 2 of the opening part 6, the amount of the light L2blocked by the opening part 6 is small and therefore the spread of thelight L1 is wide.

More specifically, if the electronic components 3 are provided at thesame heights in the examples shown in FIG. 3(A) and FIG. 3(B), thespread W1 (calculated as a diameter of irradiated light) of the light L1in the example shown in FIG. 3(A) where the thickness of the board 2 islarge is narrower than the spread W2 (calculated as a diameter ofirradiated light) of the light L2 in the example shown in FIG. 3(B)where the thickness of the board 2 is small.

Thus, in the structure where irradiation characteristics of the lightirradiated by the electronic component 3 are changed depending on thethickness of the board 2, since a light irradiation amount of the lightemitting diode chip 9 is changed depending on a plate pressure of theboard 2, it is not possible to obtain stable characteristics. Inaddition, it is necessary to change the characteristics of the lightemitting diode chip 9 corresponding to the depth of the opening part 6depending on the plate pressure of the board 2. Hence, in this case, alarge amount of time, workload or cost may be required for change ofsetting.

SUMMARY OF THE INVENTION

Accordingly, embodiments of the present invention may provide a noveland useful electronic component, manufacturing method of the electroniccomponent, electronic component assembly body, and electronic devicesolving one or more of the problems discussed above.

More specifically, the embodiments of the present invention may providean electronic component which can realize stable driving regardless ofthickness of a board, a manufacturing method of the electroniccomponent, an electronic component assembly body, and an electronicdevice.

One aspect of the present invention may be to provide an electroniccomponent, including a main body part inserted in an opening part formedin a board; and a pair of leads each of the leads having an endconnected to the main body part and another end connected to a padformed on the board; wherein the main body part is provided with theleads so that a functional surface of the main body part is positionedat a side connected to the pads of the board.

Another aspect of the present invention may be to provided amanufacturing method of an electronic component, including: a connectionstep of connecting one lead to a surface parallel with a pn connectionlayer of an electronic element having a structure where the p-type layerand the n-type layer are connected by the pn connection layer, by usinga connection material, and of connecting another lead to another surfaceparallel with the pn connection layer of the electronic element by usinga connection material; and a lead forming step of forming a supportingpart connected to and supporting the electronic element and an electrodepart functioning as an electrode, by bending the pair of the leads to anoutside.

Other aspect of the present invention may be to provided a manufacturingmethod of an electronic component, including: a connection step ofconnecting one lead to a lower surface perpendicular to a pn connectionlayer of an electronic element having a structure where a p-type layerand an n-type layer are connected by the pn connection layer, by using aconnection material, and of connecting another lead to another lowersurface perpendicular to the pn connection layer of the n-type layer ofthe electronic element by using a connection material; and a leadforming step of forming a supporting part connected to and supportingthe electronic element, an electrode part functioning as an electrode,and a connection part connecting the supporting part and the electrodepart, by bending the pair of the leads to an outside.

According to the embodiment of the present invention, the main body partof the electronic component is provided to the leads so that thefunctional surface is positioned at the side connecting to the pads ofthe lead. Because of this, the position of the functional surface in theopening part can be situated in an optional position of the leads,regardless of the depth of the opening part. Therefore, in a case wherethe electronic component is mounted on the board, it is possible toobtain stable characteristics not depending on the thickness of theboard.

Other objects, features, and advantages of the present invention will become more apparent from the following detailed description when read inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a first related art component mountingboard;

FIG. 2 is a perspective view of a second related art component mountingboard;

FIG. 3 is a perspective view for explaining problems of the exampleshown in FIG. 2;

FIG. 4 is a perspective view of a component mounting board of a firstembodiment of the present invention;

FIG. 5 is a cross-sectional view of the component mounting board of thefirst embodiment of the present invention;

FIG. 6 is a perspective view for explaining a manufacturing method ofthe component mounting board of the first embodiment of the presentinvention;

FIG. 7 is a perspective view for explaining an effect of the componentmounting board of the first embodiment of the present invention;

FIG. 8 is a cross-sectional view showing a manufacturing method of a LED(Light Emitting Diode) used for the first embodiment of the presentinvention;

FIG. 9 is a cross-sectional view of a component mounting board of asecond embodiment of the present invention;

FIG. 10 is a cross-sectional view of a component mounting board of athird embodiment of the present invention;

FIG. 11 is a cross-sectional view for explaining a manufacturing methodof a (Light Emitting Diode) used for the third embodiment of the presentinvention;

FIG. 12 is a cross-sectional view of a component mounting board of afourth embodiment of the present invention;

FIG. 13 is a cross-sectional view of a component mounting board of afifth embodiment of the present invention;

FIG. 14 is a cross-sectional view of a component mounting board of asixth embodiment of the present invention; and

FIG. 15 is a perspective view of a portable phone using the componentmounting board of the first embodiment of the present invention and itsmanufacturing method.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A description is given below, with reference to the FIG. 4 through FIG.15 of embodiments of the present invention.

FIG. 4 is a perspective view of a component mounting board of a firstembodiment of the present invention. FIG. 5 is a cross-sectional view ofthe component mounting board of the first embodiment of the presentinvention. FIG. 6 is a perspective view for explaining a manufacturingmethod of the component mounting board of the first embodiment of thepresent invention. FIG. 7 is a perspective view for explaining an effectof the component mounting board of the first embodiment of the presentinvention.

In this embodiment, an example where a light emitting diode 13A is usedas an electronic component and a component mounting board 10A where thelight emitting diode 13A is mounted on a board 12 is used as anelectronic component assembly body is discussed.

First, structures of the light emitting diode 13A and the componentmounting board 10A are discussed with reference to FIG. 4 and FIG. 5.

The light emitting diode 13A includes a pair of leads 15, transparentresin 17, a light emitting diode chip 20 as a main body part, andothers.

The leads 15 are made of copper or lead frame materials. The leads 15are formed by bending so as to have substantially L-shapedconfigurations. The lead 15 includes an electrode part 15 a and asupporting part 15 b. In a state where the light emitting diode 13A ismounted on the board 12, the electrode part 15 a is connected to the pad14 formed on the board 12 by soldering.

On the other hand, a supporting part 15 b of one lead 15 is physicallyand electrically connected to a p-type layer 22 of the light emittingdiode chip 20. A supporting part 15 b of another lead 15 is physicallyand electrically connected to an n-type layer 21 of the light emittingdiode chip 20. Furthermore, in the lead 15, the supporting part 15 bextends parallel to a pn connection layer 23 of the light emitting diodechip 20. An edge part at a functional surface side discussed below ofthis supporting part 15 b is bent outside so that the electrode part 15a connected to the pad 14 is formed.

The light emitting diode chip 20 is sandwiched by the pair of the leads15. The light emitting diode chip 20 includes the n-type layer 21, thep-type layer 22, and the connection layer 23. By a forward currentflowing between the n-type layer 21 and the p-type layer 22, a minoritycarrier is provided in the connection layer 23 so that light is emittedwhen the minority carrier is reconnected to a majority carrier. Inactual practice, light emitted by the light emitting diode chip 20 isirradiated from an upper end part of the connection layer 23. In thefollowing description, a surface where light is emitted of the lightemitting diode chip 20 is called the light emitting surface 18 or thefunctional surface.

The supporting part 15 b of the lead 15 is parallel with the connectionlayer 23 of the light emitting diode chip 20. In addition, theconnection layer 23 extends in a Z direction perpendicular to a boardsurface 12 a.

The transparent resin 17 is, for example, epoxy group resin and seals,at least, the light emitting diode chip 20. In this embodiment, thetransparent resin 17 seals the light emitting diode chip 20 and thesupporting parts 15 b. The transparent resin 17 is formed so as tocorrespond to the configuration of the opening part 16 formed in theboard 12.

Accordingly, as shown in FIG. 6, when the light emitting diode 13A ismounted on the board 12, by inserting the transparent resin 17 into theopening part 16, the light emitting diode chip 20 is positioned in adesignated position in the opening part 16. Furthermore, the leads 15(the electrode parts 15 a) come in contact with the corresponding pads14 and this contact position is fixed by soldering so that the lightemitting diode 13A is physically and electrically connected to the board12.

Details of the light emitting surface 18 of the light emitting diodechip 20 are discussed. The light emitting surface 18 functions as afunctional surface of the light emitting diode chip 20. The light isirradiated from this light emitting surface 18. This irradiation lightis actually irradiated from the connection layer 23 to the outside.

In this embodiment, the light emitting diode chip 20 is provided withthe leads 15 so that the light emitting surface 18 as the functionalsurface is positioned at a side connected to the pads 14 of the leads15. More specifically, the light emitting diode chip 20 is provided withthe leads 15 so that the light emitting surface 18 close to theelectrode parts 15 a.

Under this structure, the light irradiated from the light emittingsurface 18 of the light emitting diode chip 20 is, as shown by an arrowin FIG. 5, irradiated in an upper direction perpendicular to the boardsurface 12 a. This irradiation direction is opposite to the related artirradiation direction shown in FIG. 3.

Here, the reasons for influence on the emanation pattern of the light Lirradiated from the light emitting surface 18 as the functional surfaceare discussed.

First, the relationship between the thickness D1 of the board 12 and theemanation pattern of the light L irradiated from the light emittingsurface 18 is discussed.

In this embodiment, the light emitting surface 18 of the light emittingdiode chip 20 is positioned in the vicinity of the electrode part 15 a.Therefore, even if the thickness of the board 12 is changed, thedistance between the board surface 12 a and the light emitting surface18 of the light emitting diode chip 20, shown by an arrow H2 in FIG. 5,is always constant. In other words, the distance H2 between the boardsurface 12 a and the light emitting surface 18 is not influenced by thethickness D1 of the board 12.

Therefore, even if the light emitting diode 13A is mounted on the board12 having less thickness D2 than the thickness D1 (D2<D1) instead of theboard having the thickness D1 as shown in FIG. 4 and FIG. 5, the spreadW of the light L irradiated from the light emitting diode 13A is thesame as that of the example shown in FIG. 4 and FIG. 5. Thus, in thisembodiment, regardless of the thickness of the board, it is possible tostabilize the characteristics of the light L irradiated from the lightemitting diode 13A.

Next, the relationship between the distance shown by an arrow H1 in FIG.5 between the electrode parts 15 a and the light emitting surface 18 andthe emanation pattern of the light L irradiated from the light emittingsurface 18 is discussed. As discussed above, the light emitting diodechip 20 is sandwiched by the pair of the leads 15 and the electrodeparts 15 a may be bent against the light emitting surface 18. Therefore,the distance H1 between the electrode part 15 a and the light emittingsurface 18 influences the emanation pattern of the light L irradiatedfrom the light emitting surface 18.

More specifically, as the distance H1 becomes smaller, a shading effectof the leads 15 on the light L irradiated from the light emittingsurface 18 becomes lower. Therefore, it is possible to make theirradiation range of the light L wide. As the distance H1 becomesgreater, the shading effect of the leads 15 on the light L irradiatedfrom the light emitting surface 18 becomes higher. Therefore, theirradiation range of the light L is narrow. Thus, characteristics of thelight L irradiated from the light emitting surface 18 can be adjusted bychanging the distance H1 between the electrode parts 15 a and the lightemitting surface 18.

In addition, as discussed above, the distance H1 can be adjusted bychanging the bending position of the electrode parts 15 a against thesupporting parts 15 b. Therefore, by making a structure where the leads15 can be bent at a different bending position, it is possible to adjustthe characteristics of the light L irradiated from the mounting board10A outside.

In order to bend the leads 15 at the bending position, for example, abendable material may be selected as a material of the is leads 15 orthe leads 15 may have a bendable cross-sectional configuration.

Next, a manufacturing method of the light emitting diode 13A isdiscussed with reference to FIG. 8. FIG. 8 is a cross-sectional viewshowing a manufacturing method of the light emitting diode 13A used forthe first embodiment of the present invention.

In order to manufacture the light emitting diode 13A, first, the firstlead 15 is connected to the light emitting diode chip 20. As discussedabove, the light emitting diode chip 20 is made of the n-type layer 21,the p-type layer 22, and the connection layer 23. The first lead 15 isconnected to the n-type layer 21 or the p-type layer 22 (a firstconnection step). In this embodiment, as shown in FIG. 8(A), the firstlead 15 is connected to the p-type layer 22 by using solder 24.

Next, as shown in FIG. 8(B), the second lead 15 is connected to then-type layer 21 by using solder 24 (a second connection step).

At this time, a connection surface where each of the leads 15 of thelight emitting diode chip 20 is connected is selected as a surfaceparallel with the connection layer 23. Because of this, each of theleads 15 is parallel with the connection layer 23 in a state where thepair of the leads 15 is connected to the light emitting diode chip 20.

For connecting the pair of the leads 15 to the light emitting diode 20,the above-discussed first and second connection steps may be implementedin a lump by applying a reflow process in a state where solder paste isapplied on the surface of the leads 15 where the light emitting diodechip 20 is connected in advance so that the light emitting diode chip 20is provisionally connected between the pair of the leads 15.

After the pair of the leads 15 is connected to the light emitting diodechip 20 so that the pair of the leads 15 sandwiches the light emittingdiode chip 20 and is parallel with the connection layer 23, theelectrode parts 15 a and the supporting parts 15 b are formed by bendingthe leads 15 to the outside, namely in a direction indicated by an arrowin FIG. 8(C) (lead forming step). This forming process of the leads 15can be easily implemented by using an existing lead frame formingdevice.

FIG. 8(D) shows a state where the lead 15 are bent so that the electrodeparts 15 a and the supporting part 15 b are formed. The distanceindicated by an arrow H1 in FIG. 8(D) between the light emitting surface18 of the light emitting diode chip 20 and the electrode parts 15 a canbe optionally set by properly selecting a bending position of the leads15.

This distance H1 is equivalent to the distance H1 between the electrodeparts 15 a and the light emitting surface 18. Therefore, the distance H1between the electrode parts 15 a and the light emitting surface 18,which influences the emanation pattern of the light L irradiated fromthe light emitting surface (functional surface) 18 can be adjusted byadjusting the bending position of the lead 15 in the lead forming step.

In addition, the electrode parts 15 a require a designated length sothat the reliability of electric connections can be maintained.Therefore, in order to optionally adjust the distance H1, properlyadjusting the length of the leads 15 themselves, in addition toadjusting the bending position, is important.

After the bending process for the leads 15 is completed, a formingprocess of transparent resin 17 as an exterior member is implemented(exterior member forming step). FIG. 8(E) shows a state where thetransparent resin 17 is formed so that the light emitting diode 13A ismanufactured.

As discussed above, epoxy group resin, for example, can be used as amaterial of the transparent resin 17 and a transfer molding method canbe applied as a molding method. The transfer mold method is generallyused as a sealing method of a semiconductor device. Therefore, by thismethod, it is possible to easily seal the light emitting diode chip 20with the transparent resin 17 at low cost. While the sealing process isapplied to all parts other than a part of the electrode parts 15 a bythe transparent resin 17 in this example, it is sufficient to form thetransparent resin 17 in a range where at least the light emitting diodechip 20 is sealed.

Meanwhile, FIG. 9 through FIG. 14 shows component mounting boards 10Bthrough 10F as other examples of the above-discussed component mountingboard 10A. In these component mounting boards 10B through 10F, the lightemitting diode chip 20 is provided with the lead 15 so that the lightemitting surface 18 as the functional surface is positioned at a sideconnecting to the pad 14 of the leads 15, 25 and 26. In addition, theconnection layer 23 extends in a Z direction perpendicular to a boardsurface 12 a in a state where the light emitting diode chip 20 ismounted on the board 12.

In FIG. 9 through FIG. 14, parts that are the same as the parts of thecomponent mounting board 10A of the first embodiment of the presentinvention shown in FIG. 4 through FIG. 8 are given the same referencenumerals, and explanation thereof is partially omitted.

FIG. 9 is a cross-sectional view of a component mounting board 10B of asecond embodiment of the present invention. In the above-discussed firstembodiment of the present invention, the light emitting diode 13Aforming the component mounting board 10A has the structure where theleads 15 are bent at right angle so that the electrode parts 15 a andthe supporting parts 15 b are formed.

On the other hand, in the second embodiment of the present invention, alight emitting diode 13B forming the component mounting board 10B has astructure where a lead 25 is formed by an electrode part 25 a, asupporting board 25 b and an inclination part 25 c. The inclination part25 c is formed by the lead forming step for the lead 15. The inclinationpart 25 c is formed at the same time when the electrode part 25 a andthe supporting part 25 b. The electrode part 25 a of this embodimentcorresponds to the electrode part 15 a of the first embodiment and thesupporting part 25 b of this embodiment corresponds to the supportingpart 15 b of the first embodiment.

As discussed above, the distance H1 between the electrode part 15 a andthe light emitting surface 18 influences the emanation pattern of thelight L irradiated from the light emitting surface (functional surface)18. However, in a case such as this embodiment where the inclinationparts 25 c are provided between the electrode part 25 a and thesupporting parts 25 b, these inclination parts 25 c influences theemanation pattern of the light L irradiated from the light emittingsurface (functional surface) 18.

More specifically, since the shading effect of the leads 25 on the lightL irradiated from the light emitting surface 18 having a large angleindicated by an arrow θ in FIG. 9 and formed by the pair of theinclination parts 25 c is low, it is possible to widen the irradiationrange of the light L. If the angle θ formed by the pair of theinclination parts 25 c becomes small, the shading effect of the leads 25on the light L irradiated from the light emitting surface 18 isincreased so that the irradiation range of the light L becomes narrow.

Thus, the characteristics of the light L irradiated from the lightemitting surface 18 can be adjusted by the angle θ formed by the pair ofthe inclination parts 25 c. Therefore, according the structure of thecomponent mounting board 10B of this embodiment, adjustment of the angleθ formed by the pair of the inclination parts 25 c, in addition to theadjustment of the distance H1 between the electrode parts 25 a and thelight emitting surface 18, is made so that the characteristics of thelight L irradiated from the component mounting board 10B to outside canbe adjusted.

FIG. 10 is a cross-sectional view of a component mounting board 100 of athird embodiment of the present invention. In the third embodiment ofthe present invention, a light emitting diode 13B provided on thecomponent mounting board 100 has a structure where a lead 26 is formedby an electrode part 26 a, a supporting board 26 b and a connection part26 c. The electrode part 26 a, the supporting board 26 b and theconnection part 26 c are formed by the lead forming step for the lead15. The electrode part 65 a of this embodiment corresponds to theelectrode part 15 a of the first embodiment.

The supporting part 26 b of one of the leads 26 is connected to a bottomsurface 21 a extending in a direction perpendicular to the connectionlayer 23 of the n-type layer 21 by the solder 24. The connection part 26c of another lead 26 is connected to a bottom surface 22 a extending ina direction perpendicular to the connection layer 23 of the p-type layer22 by the solder 24. Thus, the lead 26 is supported from the bottomsurface part of the light emitting diode chip 20.

In addition, the connection part 26 c connects the electrode part 26 aand the supporting part 26 b. The connection part 26 c extends inparallel with the connection layer 23 of this embodiment and correspondsto an internal wall configuration of the opening part 16. In a statewhere the light emitting diode 13C is mounted (inserted) in the openingpart 16 formed in the board 12, the supporting part 26 b forms the samesurface of the bottom surface 12 b of the board 12. In addition, theconnection part 26 c extending in parallel with the connection layer 23comes in contact with the internal wall of the opening part 16.

Under this structure, the light emitting diode 13C directly supports abottom surface part (bottom surfaces 21 a, 22 a) of the light emittingdiode chip 20 by the supporting part 26 b. Because of this, thetransparent resin 17 is not provided on the bottom surface part of thelight emitting diode chip 20. In addition, the distance H1 between thelight emitting surface 18 and the electrode parts 26 a is set to be aminimum distance sufficient to protect the light emitting diode chip 20.

Accordingly, it is possible to make the height indicated by an arrow H2in FIG. 10 of the light emitting diode 13C small. Furthermore, since thesupporting part 26 b forms the same surface as the bottom surface 12 bof the board 12 in this embodiment, it is possible to make the thicknessof the board 12 substantially equal to the height H2 of the lightemitting diode 13C, so that it is possible to make the componentmounting board 100 have low height.

Next, a manufacturing method of the light emitting diode 13C isdiscussed with reference to FIG. 11. Here, FIG. 11 is a cross-sectionalview for explaining the manufacturing method of the light emitting diode13C used for the third embodiment of the present invention.

In order to manufacture the light emitting diode 13C, first, the pair ofthe leads 26 is connected to the light emitting diode chip 20. Morespecifically, the bottom surface 21 a extending in a directionperpendicular to the connection layer 23 of the n-type layer 21 and oneof the leads 26 are provisionally connected to each other by a solderpaste 27. The bottom surface 22 a extending in a direction perpendicularto the connection layer 23 of the p-type layer 22 and another lead 26are provisionally connected to each other by a solder paste 27. FIG.11(A) shows a state where the light emitting diode chip 20 isprovisionally connected to each of the leads 26 by the solder paste 27.

The leads 26 where the light emitting diode chip 20 is provisionallyconnected are provided in a reflow oven and heated so that the lightemitting diode chip 20 is connected to the leads 26 by the solder 24.FIG. 11(B) shows a state where the light emitting diode chip 20 isconnected to the lead 26. As a result of this, the leads 26 support thelight emitting diode chip 20 from the bottom surface part.

Next, the leads 26 are bent so that the electrode parts 26 a, thesupporting parts 26 b, and the connection parts 26 c are formed (leadforming step). The forming process of the leads 26 can be easilyimplemented by using the existing lead frame forming device.

FIG. 11(D) shows a state where the leads 26 are bent so that theelectrode parts 26 a, the supporting parts 26 b, and the connectionparts 26 c are formed. The distance indicated by an arrow H1 in FIG.11(C) between the light emitting surface 18 of the light emitting diodechip 20 and the electrode parts 26 a can be optionally set by properlyadjusting the bending position of the leads 16.

As discussed above, the distance H1 influences the emanation pattern ofthe light L irradiated from the light emitting surface (functionalsurface) 18. In this embodiment, by adjusting the bending position ofthe electrode parts 26 a against the connection parts 26 c, it ispossible to adjust the distance H1 between the electrode parts 26 a andthe light emitting surface 18 so that the characteristics of the lightirradiated from the light emitting diode 13C can be adjusted.

After the bending process of the leads 26 is completed, a formingprocess of the transparent resin 17 as an external member is implemented(external member forming step). FIG. 11(D) shows a state where thetransparent resin 17 is formed so that the light emitting diode 13C ismanufactured. In this embodiment, the transparent resin 17 is formedonly at the inside of the connection part 26 c. As discussed above, thelight emitting diode 13C having low height can be easily manufactured bythe same step as the manufacturing method for the light emitting diode13A discussed above with reference to FIG. 8.

FIG. 12 is a cross-sectional view of a component mounting board 10D of afourth embodiment of the present invention. In the fourth embodiment ofthe present invention, while the component mounting board 10D has thesame structure as the component mounting boards 10A shown in FIG. 4 andFIG. 5, a shade plate 28 is provided on the bottom surface of thetransparent resin 17 forming the light emitting diode 13A.

In the above-discussed component mounting board 10A of the firstembodiment of the present invention, nothing is provided on the bottomsurface of the transparent resin 17. On the other hand, the lightirradiated from the light emitting diode chip 20 emanates in a radiatedmanner so that a part of the light emanates into the transparent resin17 and is diffused. This light is called diffuse light. This diffuselight, in a structure of the first embodiment of the present inventionwhere nothing is provided on the bottom surface of the transparent resin17, comes out downward from the bottom surface of the transparent resin17.

In the meantime, in an electronic device such as a portable phone (seeFIG. 15) where the component mounting board 10D is provided, anelectronic component experiencing an error operation due to the lightmay be provided in the vicinity of the light emitting diode 13A. In thiscase, due to the diffuse light leaking out from the light emitting diode13A, the error operation of the electronic component may occur.

On the other hand, in the component mounting board 10D of thisembodiment, since the shade plate 28 is formed on the bottom part of thetransparent resin 17 forming the light emitting diode 13A, it ispossible to prevent the diffuse light from coming out from the bottompart of the transparent resin 17. As a result of this, even if anelectronic component whose the error operation may happen due to thelight is provided in the vicinity of the light emitting diode 13A, it ispossible to prevent the error operation of the electronic component andreliability of the electronic device where the component mounting board10D is provided can be improved.

As a detailed structure of the shade plate 28, a printed wiring board ora board having a low permeability of other light may be provided. Inaddition, an application having a shading function may be applied or ametal film having a shading function may be formed.

FIG. 13 is a cross-sectional view of a component mounting board 10E of afifth embodiment of the present invention. In the component mountingboard 10E of the fifth embodiment of the present invention having thesubstantially same structure as that of the component mounting boards10A shown in FIG. 4 and FIG. 5, a reflection plate 20 is provided on thebottom surface of the transparent resin 17 forming the light emittingdiode 13A.

As discussed above, a part of the light irradiated from the lightemitting surface 18 emanates in the transparent resin 17 as the diffuselight. In the component mounting board 10D of the fourth embodiment ofthe present invention, the shading plate 28 is provided on the bottompart of the transparent resin 17 so that this diffuse light is preventedfrom leaking out from the bottom part.

On the other hand, in this embodiment, the reflection plate 29 isprovided on the bottom part of the transparent resin 17 so that thediffuse light emanating into the bottom part of the transparent resin 17is reflected to an upper surface of the transparent resin 17. Under thisstructure, since the diffuse light as well as the light irradiated fromthe light emitting diode 13A is irradiated upward, loss of lightgenerated by the light emitting diode chip 20 can be reduced.

As a detailed structure of the reflection plate 29, a mirror may beprovided; a metal film having a high reflection rate may be formed; or asilver paste may be provided. In an example shown in FIG. 13, a silverpaste is provided on a surface of the shading plate 28 facing the bottompart of the transparent resin 17.

FIG. 14 is a cross-sectional view of a component mounting board 10F of asixth embodiment of the present invention. In the component mountingboard 10D of the fourth embodiment of the present shown in FIG. 12, theshading plate 28 having the shading function is provided at only thebottom part of the transparent resin 17. However, in the presentinvention, a position of a member having the shading function is notlimited to the bottom part of the transparent resin 17 and may beanother portion such as a side surface of the transparent resin 17.

In the light emitting diode 13A provided at the component mounting board10F of this embodiment, a shading case 30 having a cylindrical shapeconfiguration and a bottom is used. The transparent resin 17 is providedin the shading case 30. Under this structure, it is possible to securelyprevent the diffuse light from coming to the outside from a surfaceother than an upper surface of the transparent resin 17 where the lightcoming out from the light emitting surface 18 is properly irradiated tothe outside. The shading case 30 may be formed by metal or resin.

FIG. 15 shows an example where the above-discussed component mountingboard 10A is applied to a portable phone 35 as an electronic device.While the component mounting board 10A is applied to the portable phone35 in this example, other component mounting boards 10B through 10F canbe applied to the portable phone 35.

As shown in FIG. 15(A), in the component mounting board 10A, plurallight emitting diodes 13A are provided on the board 12. FIG. 15(B) showsa membrane switch 31 provided in the portable phone 35. This membraneswitch has a structure where a transparent spacer is provided between apair of transparent film electrodes. Plural switch parts 32 are formedin the membrane switch 31. By pushing a switch part 32, the switch part32 is turned ON.

The light emitting diode 13A provided in the component mounting board10A and the switch parts 32 provided in the membrane switch 31 areprovided in positions corresponding to operations keys 36 provided inthe potable phone 35. See FIG. 15(C).

When the component mounting board 10A and the membrane switch 31 areassembled in the potable phone 35, the switch parts 32 are provided onthe upper part of the component mounting board 10A and this is installedin the potable phone 35. The operations key 36 transmits light.

Therefore, when the light emitting diode 13A irradiates light from thelight emitting surface 18, this light passes through the membrane switch31 made of a transparent material so as to irradiate the operations keys36. As discussed above, since the operations keys 36 transmit the light,the light of the light emitting diode 13A can be recognized by eyes ofan operator of the portable phone 35 via the operations keys 36. Becauseof this, it is possible to improve operability of the portable phone 35,more specifically operability in a dark place.

Since the light emitting diode 13A (through 13F) of the embodiment ofthe present invention has low height, it is possible to make the size ofthe portable phone 35 where the light emitting diode 13A (through 13F)of the embodiment of the present invention is applied small.

The present invention is not limited to these embodiments, butvariations and modifications may be made without departing from thescope of the present invention.

What is claimed is:
 1. A manufacturing method of an electroniccomponent, comprising: connecting one lead of a pair of leads to asurface parallel with a pn connection layer of an electronic elementhaving a structure where a p-type layer and a n-type layer are connectedby the pn connection layer provided between the p-type layer and then-type layer, by using a connection material, and of connecting anotherlead to another surface parallel with the pn connection layer of theelectronic element by using a connection material; forming a supportingpart of the pair of the leads, the supporting part being connected toand supporting the electronic element, and an electrode part functioningas an electrode, by bending the pair of the leads to an outside; andsealing the electronic element and parts of the leads inside a lighttransparent external member after forming the supporting part, so that apart of a top surface of the light transparent external member is flushwith a top surface of the another lead, wherein each of the pair ofleads is parallel to the pn connection layer of the electronic element.